Mattson funeral home forest lake mn obituaries, Leading-edge wafer processing at high productivity levels providing customers with the most cost-effective manufacturing solution. Fremont, CA 94538 510-657-5900 info@mattson. com In that role, he advised Mattson and more than 30 other companies across a broad range of financial and operational matters. Contact Us Corporate Headquarters 47131 Bayside Pkwy. . Mattson Technology’s Plasma Etch Products Delivering Unique Plasma Source Technology Over 100 ICP Etch Systems in High Volume Production Most Flexible Millisecond Anneal & Silicidation Tool Dornstadt, Germany Manufacturing Plant Daimlerstrasse 10 89160 Dornstadt, GERMANY Tel: +49- (0)-7348-981-0 Dresden, Germany Sales and Service Office Mattson International GmbH Manfred-von-Ardenne-Ring 20 01099 Dresden, Germany Mattson Technology was founded in 1988 in Fremont, California. Our thermal products now include a wide range of rapid anneals ranging from soak to spike to millisecond flash. We are a leader in the dry strip market. Mattson Technology’s Plasma Etch Products Delivering Unique Plasma Source Technology Over 100 ICP Etch Systems in High Volume Production Most Flexible Millisecond Anneal & Silicidation Tool Dornstadt, Germany Manufacturing Plant Daimlerstrasse 10 89160 Dornstadt, GERMANY Tel: +49- (0)-7348-981-0 Dresden, Germany Sales and Service Office Mattson International GmbH Manfred-von-Ardenne-Ring 20 01099 Dresden, Germany Mattson Technology was founded in 1988 in Fremont, California. He holds a Bachelor of Science in Accounting from the University of Florida and is a Certified Public Accountant (inactive) in the State of California. Our Helios family RTP systems offer unique double-side heating RTP technology. RTP refers to a process that heats silicon wafers to high temperatures (up to 1200°C or greater) using high intensity lamps to set the electrical properties of the semiconductor devices. After breaking into the semiconductor equipment industry as a leading supplier of dry strip equipment, we expanded our portfolio of processing equipment to also include plasma etch, rapid thermal anneal and millisecond anneal. The Aspen III’s exceptional platform design can handle both 200 mm and 300 mm wafers, and supports special wafer handling including warped and translucent wafers. Our strip systems offer…Read More » Aspen® III Based on proprietary ICP source design with grounded Faraday shield, Aspen III delivers production proven and cost-effective strip and etch solutions to semiconductor manufacturers worldwide. It can achieve Dry strip is the removal of the masking layers from the wafer after the patterning process has been completed. The unique process chamber Based on an industry leading remote plasma technology, Mattson Technology’s Novyka ® family selective etch systems offer unique process solutions and deliver outstanding results in isotropic and anisotropic etch of various dielectric and conductor materials. The objective is to eliminate the masking material from the wafer as quickly as possible, without allowing any surface materials to become damaged.
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